Products
Spherical alumina and silica powder portfolio.
SRP's product line covers high-purity alumina, easy-sintering alumina, low-alpha alumina, and spherical silica grades with controlled particle size, purity, sphericity, conductivity, and surface chemistry.
Product Family Overview
| Family | Representative Grades | Key Control Range | Typical Use |
|---|---|---|---|
| High-Purity Spherical Alumina | DC3-U, DC3-F, DC3-C, DC3-M, DC3-L, DC3-S; DC4 series | D50 from 0.15 to 10 microns; purity >99.9%; 100% sphericity target | TIM fillers, ceramic membranes, transparent ceramics, sapphire loading |
| Easy-Sintering Spherical Alumina | DCS302-U, DCS302-F, DCS302-UG, DCS302-FG | D50 from 0.25 to 0.45 microns; sintering temperature 1500 C; sintered density >3.9 g/cm3 | Advanced ceramic processes requiring dense sintering and submicron control |
| Low-Alpha Spherical Alumina | LA4-U, LA4-F, LA5-U, LA5-F | D50 from 0.15 to 0.30 microns; U+Th down to <1 ppb in LA5 grades | HBM, LPDDR, EMC, and advanced semiconductor packaging |
| Spherical Silica | SP2-500, SP3-300, SP3-500, SP3-1000, SP3-1500, SP3-2000J, SP4-1000, SP4-1500J | D50 from 0.2 to 2 microns; D100 controlled below 4 to 10 microns depending on grade | CCL, aluminum-based CCL bonding sheets, EMC, engineering plastics, coatings, and functional fillers |
High-Purity Spherical Alumina
DC series alumina grades provide high sphericity, controlled particle size, high purity, and optional surface treatment for thermal and ceramic systems.
| Grade | D10 | D50 | D90 | Purity | Notes |
|---|---|---|---|---|---|
| DC3-U | 0.18 micron | 0.25 micron | 2.5 microns | >99.9% | Raw powder; 100% sphericity target |
| DC3-F | 0.06 micron | 0.15 micron | <0.8 micron | >99.9% | Fine grade; surface modification available |
| DC3-C / DC3-M / DC3-L | 1 to 3 microns | 4 to 10 microns | 15 to 20 microns | >99.9% | Coarser grade range for filler packing and thermal systems |
| DC3-S | 0.06 micron | 0.15 micron | <0.4 micron | >99.9% | Tight top-cut option for submicron applications |
Low-Alpha Alumina
LA series alumina is positioned for advanced packaging applications that require low radioactive impurities and strict conductivity control.
| Grade | D50 | Conductivity | Purity | U+Th | Surface Treatment |
|---|---|---|---|---|---|
| LA4-U | 0.30 micron | <=10 uS/cm | >99.99% | <10 ppb | Available |
| LA4-F | 0.15 micron | <=10 uS/cm | >99.99% | <10 ppb | Available |
| LA5-U | 0.30 micron | <=10 uS/cm | >99.99% | <1 ppb | Available |
| LA5-F | 0.15 micron | <=10 uS/cm | >99.99% | <1 ppb | Available |
Spherical Silica
SP series silica powders provide narrow particle size distribution, high sphericity, purity control, low conductivity options, and surface treatment for electronic materials.
| Grade Group | D50 Range | D100 Control | Purity | Primary Fit |
|---|---|---|---|---|
| SP2-500 | 0.5 micron | <5 microns | >99% | Cost-sensitive silica filler applications |
| SP3-300 / SP3-500 | 0.3 to 0.5 micron | <4 to <5 microns | >99.9% | Submicron CCL, aluminum-based CCL bonding sheets, EMC, and resin systems |
| SP3-1000 / SP3-1500 / SP3-2000J | 1.0 to 2.0 microns | <6 to <10 microns | >99.9% | Filler packing and flow control |
| SP4-1000 / SP4-1500J | 1.0 to 1.5 microns | <6 to <10 microns | >99.99% | Higher-purity electronic silica applications |
Surface treatments include amino, epoxy, acrylic, alkyl, and other customer-specific chemistries.
Benchmark Comparison Snapshot
Includes anonymized benchmark data comparing SRP SP3-500 and SP4-500 spherical silica with peer silica grades. The table below highlights the public-site-safe technical points.
| Metric | SRP SP3-500 | Peer C Grade | SRP SP4-500 | Peer E Grade | What It Shows |
|---|---|---|---|---|---|
| D50 | 0.5 micron | 0.4-0.6 micron | 0.5 micron | 0.4-0.6 micron | Comparable submicron particle-size positioning. |
| D10 / D90 | 0.25 / 1.5 micron | Not listed in source | 0.25 / 1.5 micron | Not listed in source | SRP publishes tighter particle-distribution reference points in the deck. |
| Sphericity | 100% | Not listed in source | 100% | Not listed in source | Supports flow, packing, and filler behavior claims. |
| Specific surface area | 6 m2/g | 4-7 m2/g | 6 m2/g | 4-7 m2/g | Falls within the comparable peer benchmark range. |
| pH | 7.0 | 4.2-5.0 | 7.0 | 4.5-6.0 | Neutral pH positioning can help with resin-system formulation stability. |
| Conductivity | <20 uS/cm | Not listed in source | <10 uS/cm | Not listed in source | Highlights low-conductivity options for electronic materials. |
| Purity | >99.9% | >99.8% | >99.99% | >99.9% | Shows higher stated purity for the SRP grades in the source comparison. |
| Metallic impurities | Al <700 ppm; Fe <500 ppm; Na/K <1 ppm | Al <700 ppm; Fe <500 ppm; Na/K <1 ppm | Al <70 ppm; Fe <30 ppm; Na/K <0.5 ppm | Al <100 ppm; Fe <20 ppm; Na/K <0.5 ppm | Positions SP4-500 for higher-purity electronic silica requirements. |
| Uranium | <20 ppb | Not listed in source | <1 ppb | <0.3 ppb | Shows low-radioactivity control for advanced electronic applications. |